The Magic Polishing material

   In the world of precision manufacturing and surface finishing, cerium oxide polishing powder has emerged as a game – changing material. Its unique properties make it an essential component in a wide range of polishing applications, from the delicate surfaces of optical lenses to the high – tech wafers in semiconductor manufacturing.

  The polishing mechanism of cerium oxide is a fascinating blend of chemical and mechanical processes. Chemically, cerium oxide (CeO₂) takes advantage of the variable valence states of the cerium element. In the presence of water during the polishing process, the surface of materials like glass (largely composed of silica, SiO₂) becomes hydroxylated. CeO₂ then reacts with the hydroxylated silica surface. It first forms a Ce – O – Si bond. Due to the hydrolytic nature of the glass surface, this further transforms into a Ce – O – Si(OH)₃bond.

   Mechanically, the hard, fine – grained cerium oxide particles act like tiny abrasives. They physically scrape away the microscopic irregularities on the material’s surface. As the polishing pad moves across the surface under pressure, the cerium oxide particles grind down the high points, gradually flattening the surface. The mechanical force also plays a role in breaking the Si – O – Si bonds in the glass structure, facilitating the removal of material in the form of small fragments. One of the remarkable features of cerium oxide polishing is its ability to self – adjust the polishing rate. When the material surface is rough, the cerium oxide particles aggressively remove material at a relatively high rate. As the surface becomes smoother, the polishing rate can be adjusted, and in some cases, even reach a “self – stop” state. This is due to the interaction between the cerium oxide, the polishing pad, and the additives in the polishing slurry. Additives can modify the surface chemistry and the adhesion between the cerium oxide particles and the material, effectively controlling the polishing process.