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| Etchant Type | Chemical Composition | Application | Features | Ideal Substrate |
|---|---|---|---|---|
| Aqueous Hydrofluoric Acid | HF + H2O | Silicon Wafer Etching | High precision, low residue | Silicon |
| Ammonium Persulfate | (NH4)2S2O8 | Metal Etching | Safe, selective etching | Copper, Aluminum |
| Buffered Oxide Etch | NH4F + HF | Oxide Removal | Stable etching rate | Silicon Dioxide |
| Ionized Ethanol | C2H5OH | Photoresist Stripping | Biodegradable, efficient | Photoresist |